JPH0377459U - - Google Patents
Info
- Publication number
- JPH0377459U JPH0377459U JP1990125696U JP12569690U JPH0377459U JP H0377459 U JPH0377459 U JP H0377459U JP 1990125696 U JP1990125696 U JP 1990125696U JP 12569690 U JP12569690 U JP 12569690U JP H0377459 U JPH0377459 U JP H0377459U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- package substrate
- flat part
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990125696U JPH0419806Y2 (en]) | 1990-11-27 | 1990-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990125696U JPH0419806Y2 (en]) | 1990-11-27 | 1990-11-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377459U true JPH0377459U (en]) | 1991-08-05 |
| JPH0419806Y2 JPH0419806Y2 (en]) | 1992-05-06 |
Family
ID=31673560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990125696U Expired JPH0419806Y2 (en]) | 1990-11-27 | 1990-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419806Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289447A (ja) * | 2008-05-27 | 2009-12-10 | Hitachi Ltd | 配線基板及びこれを備えた電子装置 |
| WO2019182080A1 (ja) * | 2018-03-22 | 2019-09-26 | 株式会社アドヴィックス | プレスフィット端子接続装置 |
-
1990
- 1990-11-27 JP JP1990125696U patent/JPH0419806Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289447A (ja) * | 2008-05-27 | 2009-12-10 | Hitachi Ltd | 配線基板及びこれを備えた電子装置 |
| WO2019182080A1 (ja) * | 2018-03-22 | 2019-09-26 | 株式会社アドヴィックス | プレスフィット端子接続装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0419806Y2 (en]) | 1992-05-06 |